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E95 and the K1 Factor


Figure 3
Now, let’s discuss about the relationship between E95 and
the k1 factor. The k1 factor indicates the difficulty of the lithography
process; it is determined by the target design rule, numerical
aperture (NA), and laser exposure wavelength according to the following
formula:
| k1 = Design Rule * NA of Lithography Tool/Laser
Exposure Wavelength |
In general, to achieve a higher yield in the mass-production process
of semiconductors, k1 is set to near 0.4 while the NA and laser
exposure wavelength of the lithography tool are determined based
on the set k1 value. However, as the target design rule continues
to become finer, the k1 value needs to be reduced to near 0.3 due
to the NA limit of the lithography tool and the difficulty in shortening
of the exposure wavelength. For example, achieving 90 nm in a KrF
process or 65 nm in an ArF process requires reduction of the k1
value. From the viewpoint of cost, reducing k1 allows use of the
laser with a fairly low NA and longer wavelength, thus reducing
the equipment cost to subsequently lowering the manufacturing cost
of semiconductor devices. Use of a KrF laser instead of an ArF
laser for the 90-nm technology node is a typical example of this
trend.
On the other hand, reducing the k1 value may cause the yield to
be lowered because it limits the process margin. To enhance the
yield, the resolution needs to be increased by improving the reticle
while immersion lithography technology needs to be introduced to
increase the NA of lithography tool in pseudo manner.
E95 makes a great contribution to reduction of the k1 factor.
Figure 3 shows the upper limit required for each k1 factor. As
this figure indicates, a narrower E95 is required as the k1 factor
becomes smaller. The reason is that a smaller distribution of spectrums
is required to reduce the impact of the chromatic aberration generated
in a lithography tool as the target design rule becomes smaller.
For example, the maximum E95 was approx. 1.8 pm for the target
design rule of 150 nm in a KrF process with a k1 factor of 0.4.
On the other hand, the E95 must be reduced to 0.8 pm for the target
design rule of 90 nm in a KrF process with a k1 factor of 0.3 to
reduce the impact of chromatic aberration for better resolution.
The E95 corresponding to each k1 factor shown in figure 3 becomes
the requirement for achieving the resolution required for imaging
the target design pattern.
E95 Stability

Figure 4
For the generation with a k1 factor of 0.4 or more, it was considered
that there was no problem if the E95 varies within its set upper
limit. As the k1 factor becomes smaller than 0.4, however, fluctuation
of the E95 directly impacts on the CD.
Figure
4 shows the estimated variance of the CD (variance per 1 pm) caused
by fluctuation of the E95 for each k1 factor. While it varies slightly
depending
on the illumination condition and the characteristics of the photoresist used,
it plots an almost average result. The data shown in this figure indicates
that the CD varies by 7 to 8 nm as the E95 varies only 1 pm even if the k1
factor becomes 0.3 for the KrF process. This variation is four times greater
than that for the KrF process with the k1 factor of 0.4. For the ArF process,
meanwhile, it has been confirmed that the variation produces an impact twice
as large as that for the KrF process. That is, if the k1 factor is reduced
to 0.3 for the ArF process, the CD will vary 14 to 16 nm. Such a CD error at
this level cannot be ignored, and represents a big difficulty. Therefore, it
is apparent that improvement of the stabilization of the E95 is a big challenge
for the next-generation lithography process. As proved in this survey, the E95 produces an especially large
impact on isolated lines but a small impact on dense lines. That
is, bias generated in a pattern with a mixture of isolated and
dense lines is closely related to the E95. This will be studied
in detail in the following lectures.
We have discussed the factor that causes fluctuation of the E95,
and have quantitatively indicated the impact of the E95 upon the
CD. The next lecture will introduce a technology for stabilizing
the E95, which is developed by Gigaphoton to stabilize the CD.
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