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<h5 class="wp-block-heading">Gigaphoton survey reveals important data that can unleash intelligence for the semiconductor industry</h5>



January 7, 2022



OYAMA, Japan – January 7, 2022 – Gigaphoton Inc., (Head Office: Oyama, Tochigi; President and CEO: Katsumi Uranaka), a manufacturer of light sources used in semiconductor lithography, today released the results of a survey that provides insights into the current state of the semiconductor manufacturing industry. The results reveal significant gaps in semiconductor manufacturing analytics capabilities that could help solve the semiconductor shortage and unleash intelligence for the global semiconductor industry.



The Gigaphoton survey reveals unmet analytics needs that offer a roadmap to what the semiconductor industry must do to meet growing demand and help solve the chip shortage. Shrinking chip sizes and advancing technology are challenging the ability of semiconductor manufacturers to sustain uptime and yield. At the same time, worldwide demand is increasing, and shortages throughout the supply chain have forced semiconductor manufacturers to focus their attention on using analytics to gain efficiencies with their equipment and processes.



“As semiconductor manufacturing processes have become more complex, we’ve seen an increase in customer requests for more advanced intelligence into our tools, and each customer needs something unique. Since COVID, we believe these requests will be compounded further as semiconductor manufacturers scale up their chip production,” said Yuji Minegishi, General Manager at Gigaphoton.



As manufacturing processes continue to require greater precision, it has been challenging for chip manufacturers to achieve the depth and breadth of intelligence they need to increase or even sustain uptime. Currently, intelligence is siloed among proprietary analytics solutions developed by tool manufacturers and third-party analytics platforms. This creates barriers to usability which are becoming more problematic as processes become more complex.



Gigaphoton conducted a survey with 276 responses from semiconductor manufacturing respondents in all aspects of the manufacturing process. The survey showed that 73% of chip manufacturers must piece together multiple equipment analytics solutions. Despite all the solutions they use and the large investments they make on software, most still don’t have the efficient advanced analytics capabilities they need to increase uptime and output.



“The survey results reveal a significant gap in semiconductor manufacturing analytics capabilities that can’t really be filled by a single software vendor. This is a global semiconductor industry problem that will need an industry-wide solution,” said Mario Faria, Vice President and Partner, Americas at the MAX Group.



“This study has helped us uncover the industry’s critical need for more advanced and intelligent analytics capabilities,” said Katsumi Uranaka, President and CEO of Gigaphoton. “We are committed to providing state of the art advanced platforms and solutions to help our customers increase productivity and output.”



Download the full report from <a href="https://fabscape.net/survey">https://fabscape.net/survey</a> to learn more.







<figure class="wp-block-table is-style-regular"><table><tbody><tr><td>About Gigaphoton Since it was founded in 2000, Gigaphoton has delivered valuable solutions to semiconductor manufacturers throughout the world as a manufacturer of light sources and equipment analytics software. In every stage from R&amp;D to manufacture, sales, and maintenance services, Gigaphoton is committed to providing world-class support delivered from the perspective of everyday users. For more information about Gigaphoton, visit <a href="https://www.gigaphoton.com/">https://www.gigaphoton.com</a>. For information about Fabscape, a secure, open equipment monitoring and analytics platform developed by Gigaphoton, visit <a href="https://www.fabscape.net">https://www.fabscape.net</a>. Media Contact: Gigaphoton Inc. <meta charset="utf-8"></meta>E-mail web_info@gigaphoton.com or visit <a href="https://fabscape.net/contact">https://fabscape.net/contact</a></td></tr></tbody></table></figure>

Semiconductor Manufacturing Survey Reveals Insights to End Chip Shortage

Gigaphoton has been selected by the Ministry of Economy, Trade and Industry (METI) as as one of the assignee for the project &#8220;Research and Development of Enhanced Infrastructures for Post 5G Information and Communications Systems&#8221; and was introduced on the Ministry&#8217;s website.
Please take a look.
Gigaphoton&#8217;s development themes are listed in the following ” 3. Adoption results “
(two PDF files).
<a href="https://www.meti.go.jp/english/press/2021/0616_001.html">Click here for the link.</a>

Gigaphoton has been selected by METI asone of the assignee for the project “Research and Development of Enhanced Infrastructures for Post 5G Information and Communications Systems”.

Gigaphoton has won The Best Supplier in WFE Subsystems Award from VLSI Research, Inc. and has been introduced on their website.
Please take a look.
<a href="https://www.vlsiresearch.com/gigaphoton-honored-with-first-the-best-award-PFEL1SE1000WJOJ#page1">Click here for the link.</a>

Gigaphoton has won The Best Supplier in WFE Subsystems Award from VLSI Research, Inc.

Gigaphoton will present the following papers at the &#8220;<a href="https://spie.org/search?term=gigaphoton&amp;pageSize=25&amp;pagesVisited=1&amp;sortBy=Relevance&amp;eventName=Advanced_Lithography">SPIE Advanced Lithography 2021</a>&#8221; digital forum, to be held on February 22 (Sun.) through 26 (Thu.) 2021.
This conference is one of the largest event of advanced lithography for semiconductor manufacturing.
Gigaphoton presents following 8 papers discussing advanced lightsource technology which improves yield and availability for semiconductor manufacturing.
 
<ul>
<li>Oral Presentation</li>
</ul>
February 25, 2021 • 10:50 AM PST | Session 11: EUV Source [Extreme Ultraviolet (EUV) Lithography XII] 
Update of &gt;300W High Power LPP-EUV Source Challenge III for Semiconductor HVM                 
Author: Hakaru Mizoguchi; Gigaphoton Inc. (Japan) 
[Paper#: 11609-48]
February 24, 2021 • 9:40 AM PST | Session 4: Lithography Equipment and New Applications [Optical Lithography XXXIV] 
Latest ArF light source with speckle reduction technology for immersion lithography improving chip yield               
Author: Hirotaka Miyamoto; Gigaphoton Inc. (Japan) 
[Paper#: 11613-11]
February 25, 2021 • 8:50 AM PST | Session 8: Novel Optical and ebeam/ion [Novel Patterning Technologies 2021] 
Processability of organic material for semiconductor packaging by 248 nm excimer laser               
Author: Akira Suwa; Gigaphoton Inc. (Japan) 
[Paper#: 11610-27]
<ul>
<li>Poster Presentation</li>
</ul>
February 24, 2021 • 5:30 PM PST | Poster Session [Optical Lithography XXXIV] 
ArF lightsource “GT66A” for next-generation immersion lithography enhancing EPE and CD performance                
Author: Tommy Oga; Gigaphoton Inc. (Japan) 
[Paper#: 11613-30]
February 24, 2021 • 5:30 PM PST | Poster Session [Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV] 
Study of further CD and OL performance improvement by introducing new E95% spectral bandwidth and Wavelength functionality for ArFi lithography lightsource              
Author: Tommy Oga; Gigaphoton Inc. (Japan) 
[Paper#: 11611-92]
February 24, 2021 • 5:30 PM PST | Poster Session [Optical Lithography XXXIV] 
Advanced spectral engineering: A new way of process aware laser spectra optimization for optical lithography   
Author: Koichi Fujii; Gigaphoton Inc. (Japan) 
[Paper#: 11613-33]
February 24, 2021 • 5:30 PM PST | Poster Session [Optical Lithography XXXIV] 
Lithocell availability improvement through light source maintenance cycle improvement and optimization and its availability impact analysis for cutting-edge ArFi Light source         
Author: Takehiko Tomonaga; Gigaphoton Inc. (Japan) 
[Paper#: 11613-29]
February 24, 2021 • 5:30 PM PST | Poster Session [Extreme Ultraviolet (EUV) Lithography XII] 
The development progress of the High Power LPP-EUV light source using a magnetic field 
Author: Hirokazu Hosoda; Gigaphoton Inc. (Japan) 
[Paper#: 11609-52]

NewsNews

Semiconductor Manufacturing Survey Reveals Insights to End Chip Shortage

Gigaphoton has been selected by METI asone of the assignee for the project “Research and Development of Enhanced Infrastructures for Post 5G Information and Communications Systems”.

Gigaphoton has won The Best Supplier in WFE Subsystems Award from VLSI Research, Inc.

Technical Papers in SPIE Advanced Lithography 2021