Showcasing Excimer Laser Technologies for Advanced Chiplet Packaging Applications

Oyama, Tochigi; May 12, 2026, Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that it will exhibit at The 2026 IEEE 76th Electronic Components and Technology Conference, which will take place in Orlando, Florida, from May 26 through 29.

Gigaphoton has long been engaged in research on excimer lasers for micro via and trench processing, and has participated in past ECTC conferences where it presented related technical papers.
In recent years, excimer laser-based micro via and trench processing have attracted increasing attention in the manufacturing of advanced semiconductor packages using chiplets, which are expected to see growing demand particularly in AI server applications.
Therefore, to introduce Gigaphoton’s technologies to a broader audience, it will exhibit a booth showcasing detailed processing examples and applications.

We welcome your visit and look forward to engaging with you at the event.

About GIGAPHOTON

Since it was founded in 2000, GIGAPHOTON has delivered valuable solutions to semiconductor manufacturers throughout the world as a manufacturer of lightsources. In every stage from R&D to manufacture, sales, and maintenance services, GIGAPHOTON is committed to providing world-class support delivered from the perspective of everyday users. For more information, please visit https://gigaphoton.com/