Oyama, Tochigi; September 30, 2025, Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, exhibits to Advanced Packaging and Chiplet Summit 2025 (APCS 2025), held in Tokyo Big Sight, Tokyo, Japan from Wednesday, December 17 through Friday, December 19, 2025, concurrently with SEMICON Japan 2025.
Gigaphoton will introduce its advanced ablation processing products, including the latest test results.
We would like to welcome your visit.
| Exhibition | Advanced Packaging and Chiplet Summit 2025 |
| HP Address | https://www.semiconjapan.org/en/apcs |
| Holding Period | from December 17 through 19 |
| Place | Tokyo Big Sight |
| Booth No. | E6345 |
About GIGAPHOTON
Since it was founded in 2000, GIGAPHOTON has delivered valuable solutions to semiconductor manufacturers throughout the world as a manufacturer of lightsources. In every stage from R&D to manufacture, sales, and maintenance services, GIGAPHOTON is committed to providing world-class support delivered from the perspective of everyday users. For more information, please visit https://gigaphoton.com/
| Media Contact: GIGAPHOTON Inc. Corporate Planning Department Email: web_info@gigaphoton.com |