Oyama, Tochigi; October 13, 2026,Gigaphoton Inc.(Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, exhibits to Advanced Packaging and Chiplet Summit 2026 (APCS 2026), held in Tokyo Big Sight, Tokyo, Japan from Wednesday, December 9 through Friday, December 11, 2026, concurrently with SEMICON Japan 2026.

Gigaphoton will introduce its advanced ablation processing products, including the latest test results.
We would like to welcome your visit.

About GIGAPHOTON

Established in 2000, GIGAPHOTON is a leading provider of KrF and ArF excimer laser lightsources for semiconductor lithography. 
GIGAPHOTON enables semiconductor manufacturers worldwide to achieve higher productivity, superior quality, and more sustainable manufacturing through its advanced laser technologies. 
Its global service network delivers customer-focused support, dedicated to  driving maximizingum availability and stable production operations for semiconductor manufacturers around the world. 
Leveraging its expertise in laser and lithography technologies, GIGAPHOTON is expanding its capabilities beyond semiconductor lithography into new fields, including EUV lightsources, excimer lasers for advanced packaging and advanced material processing applications.. 

For more information, please visit https://www.gigaphoton.com