Oyama, Tochigi; September 29, 2023, Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Katsumi Uranaka), a manufacturer of lightsources for semiconductor lithography, exhibits to APCS (Advanced Packaging and Chiplet Summit) 2023, held in Tokyo Big Sight, Tokyo, Japan from Wednesday, December 13 through Friday, December 15, 2023 JST.

Gigaphoton will introduce its advanced ablation processing products, including the latest test results.

We would like to welcome your visit.

ExhibitionAdvanced Packaging and Chiplet Summit 2023
HP Addresshttps://www.semiconjapan.org/en/apcs
Holding Periodfrom December 13 through 15
PlaceTokyo Big Sight
Booth No.2748


Since it was founded in 2000, GIGAPHOTON has delivered valuable solutions to semiconductor manufacturers throughout the world as a manufacturer of lightsources. In every stage from R&D to manufacture, sales, and maintenance services, GIGAPHOTON is committed to providing world-class support delivered from the perspective of everyday users. For more information, please visit https://gigaphoton.com/

Media Contact:
Corporate Planning Department
Kenji Ohishi
TEL: +81-285-37-6931
Email: web_info@gigaphoton.com